The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2005
Filed:
Jun. 04, 2002
Yoshitaka Fukuoka, Fuchu, JP;
Tooru Serizawa, Tokyo, JP;
Hiroshi Yagi, Tokyo, JP;
Osamu Shimada, Fuchu, JP;
Hiroyuki Hirai, Fuchu, JP;
Yuji Yamaguchi, Tokyo, JP;
Yoshitaka Fukuoka, Fuchu, JP;
Tooru Serizawa, Tokyo, JP;
Hiroshi Yagi, Tokyo, JP;
Osamu Shimada, Fuchu, JP;
Hiroyuki Hirai, Fuchu, JP;
Yuji Yamaguchi, Tokyo, JP;
Dai Nippon Printing Co., Ltd., Tokyo, JP;
D.T. Circuit Technology Co., Ltd., Tokyo, JP;
Abstract
A fabricating method of a wiring board provided with passive elements is disclosed. The fabricating method includes coating one or both of resistive paste and dielectric paste on at least any one of first surfaces of a first metal foil and a second metal foil each of which has a first surface and a second surface; arranging an insulating board having thermo-plasticity and thermo-setting properties so as to face the first surface of the first metal foil, and arranging the first surface side of the second metal foil so as to face a surface different from a surface to which the first metal foil faces of the insulating board; forming a double-sided wiring board by stacking, pressurizing and heating the arranged first metal foil, insulating board, and second metal foil, and thereby integrating these; and patterning the first metal foil and/or the second metal foil.