The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2005
Filed:
May. 27, 2003
Michiyoshi Takano, Okaya, JP;
Michiyoshi Takano, Okaya, JP;
Seiko Epson Corporation, Tokyo, JP;
Abstract
The invention includes a semiconductor device, and a method for making the same, wherein bumps of a semiconductor chip and inner leads of a film tape carrier can be securely bonded to each other by thermal welding using a heating unit. A semiconductor waferis etched using a potassium iodide or ammonium iodide solution. By the etching, a barrier metal layeris removed while the upper face of a bumpis simultaneously roughened and many prominencesare formed. The formation of the prominencesincreases the surface area of the upper face of the bumpand improves the bonding between the bumpof the semiconductor chip and the lead of the film tape carrier.