The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2005
Filed:
Nov. 25, 2002
Satoshi Ishino, Kusatsu, JP;
Kenji Kubota, Sabae, JP;
Tsuyoshi Saito, Fukui, JP;
Michinobu Maesaka, Omihachiman, JP;
Mamoru Ogawa, Moriyama, JP;
Jiro Inoue, Omihachiman, JP;
Hiroaki Kaida, Moriyama, JP;
Satoshi Ishino, Kusatsu, JP;
Kenji Kubota, Sabae, JP;
Tsuyoshi Saito, Fukui, JP;
Michinobu Maesaka, Omihachiman, JP;
Mamoru Ogawa, Moriyama, JP;
Jiro Inoue, Omihachiman, JP;
Hiroaki Kaida, Moriyama, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Abstract
A method of forming an electronic component includes laminating ceramic green sheets on a support film to obtain a ceramic green sheet laminate, forming through holes through the ceramic green sheet laminate at positions where via hole electrodes are to be located, applying conductive material into the through holes so as to fill the through holes and so as to be located on the upper surface of the ceramic green sheet laminate to form via hole electrodes, and sintering the ceramic green sheet laminate to form a substrate and so as to form protruding portions of the via hole electrodes which protrude upward from the upper surface of the substrate.