The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 22, 2005

Filed:

Jun. 18, 2003
Applicants:

Istvan Novak, Maynard, MA (US);

Shlomo D. Novotny, Wayland, MA (US);

Kenneth M. Weiss, Westford, MA (US);

Inventors:

Istvan Novak, Maynard, MA (US);

Shlomo D. Novotny, Wayland, MA (US);

Kenneth M. Weiss, Westford, MA (US);

Assignee:

Sun Microsystems, Inc., Santa Clara, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L023/52 ; H01L023/34 ; H01L021/44 ; H01L021/48 ; H01L021/50 ;
U.S. Cl.
CPC ...
Abstract

A chip package for reduced EMI. In one embodiment, a chip package includes a semiconductor chip mounted on a substrate. First and second horizontal conductors may be present within the substrate. The semiconductor chip is coupled to the first and second horizontal conductors by a first and second pluralities of vertical conductors, respectively. The silicon chip may receive power via the first horizontal conductor and the first plurality of vertical conductors. The first and second horizontal conductors are connected to external connectors by third and fourth pluralities of vertical conductors, respectively. One or more capacitors may be electrically coupled between the first and second horizontal conductors.


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