The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 22, 2005

Filed:

Jul. 30, 2003
Applicants:

James Chingwei LI, San Diego, CA (US);

Richard L. Pierson, Jr., Thousand Oaks, CA (US);

Berinder P. S. Brar, Newbury Park, CA (US);

John A. Higgins, Westlake Village, CA (US);

Inventors:

James Chingwei Li, San Diego, CA (US);

Richard L. Pierson, Jr., Thousand Oaks, CA (US);

Berinder P. S. Brar, Newbury Park, CA (US);

John A. Higgins, Westlake Village, CA (US);

Assignee:

Innovative Technology Licensing, LLC, Thousand Oaks, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L029/40 ;
U.S. Cl.
CPC ...
Abstract

A bipolar junction transistor (BJT) requires the fabrication of a BJT structure and of a support post which is adjacent to, but physically and electrically isolated from, the BJT structure. The BJT structure includes a semi-insulating substrate, a subcollector, a collector, a base, and an emitter. Metal contacts are formed on the subcollector and emitter to provide collector and emitter terminals. Contact to the structure's base is accomplished with a metal contact which extends from the top of the support post to the edge of the base nearest the support post. The contact bridges the physical and electrical separation between the support post and the base and provides a base terminal for the device. The base contact need extend over the edge of the base by no more than the transfer length associated with the fabrication process. This results in the smaller base contact area over the collector than would otherwise be necessary, and a consequent reduction in base-collector capacitance. The invention is particularly useful when forming heterojunction bipolar transistors (HBTs), built on a compound semiconductor substrate such as indium phosphide (InP).


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