The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2005
Filed:
Aug. 05, 2002
Junichi Hikita, Kyoto, JP;
Koji Yamamoto, Kyoto, JP;
Isamu Nishimura, Kyoto, JP;
Nobuhisa Kumamoto, Kyoto, JP;
Junichi Hikita, Kyoto, JP;
Koji Yamamoto, Kyoto, JP;
Isamu Nishimura, Kyoto, JP;
Nobuhisa Kumamoto, Kyoto, JP;
Rohm Co., Ltd., Kyoto, JP;
Abstract
A semiconductor chip () to be positioned with a front face thereof downward for formation of a chip-on-chip structure has electrode marks () provided on a back face () thereof. The electrode marks () are respectively provided in association with a plurality of electrodes () provided on the front face () of the semiconductor chip in the same arrangement as the arrangement of the electrodes (). The arrangement of the electrode marks () represents the arrangement of the electrodes () on the front face () when viewed from the side of the back face () of the semiconductor chip. Therefore, the semiconductor chip () can easily be positioned with the front face downward on the basis of the electrode marks ().