The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2005
Filed:
Sep. 11, 2003
Yasumasa Hattori, Ehime, JP;
Nobuyuki Kii, Ehime, JP;
Atsushi Kanesaka, Ehime, JP;
Sumitomo Metal Mining Co., Ltd., Tokyo, JP;
Abstract
A fine powder of metallic copper, suitable as a material for electroconductive pastes, and having a BET diameter of 3 μm or less, large crystallite size, high dispersibility and particles of high sphericity and a process for producing the same. More specifically, a fine powder of metallic copper having a BET diameter of 3 μm or less, particles of high sphericity and crystallites of 0.1 to 10 μm in size, and more preferably containing oxygen at 0.3% by weight or less. Moreover, the fine powder of metallic copper can be produced stably and efficiently by blowing an ammonia-containing gas onto molten copper kept at 1120° C. More specifically, it can be produced more stably and efficiently by blowing ammonia at 0.015 L/minute or more per unit area (cm) of the molten copper.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile