The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 15, 2005

Filed:

Jun. 23, 2003
Applicants:

Lewis R. Dov, Monument, CO (US);

John F. Casey, Colorado Springs, CO (US);

Inventors:

Lewis R. Dov, Monument, CO (US);

John F. Casey, Colorado Springs, CO (US);

Assignee:

Agilent Technologies, Inc., Palo Alto, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P001/00 ;
U.S. Cl.
CPC ...
Abstract

Method and apparatus for interfacing a circuit, such as a microcircuit, with an IC. The circuit is formed on a thick film dielectric structure supported by a substrate having a cut out to receive the IC. A ground plane is formed on the substrate. The thick film dielectric structure abuts the cut out with an area having at least two projections forming at least one recess, the edge of the recess having a conductive layer in electrical communication with the ground plane. A conductive pad on top of the dielectric structure is in electrical communication with the conductive layer in the recess. A ground connection on the IC is connected to the conductive pad thereby grounding the IC.


Find Patent Forward Citations

Loading…