The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2005
Filed:
Mar. 31, 2003
Joe P. Wang, Long Grove, IL (US);
Cheryl B. Field, Kildeer, IL (US);
Michael Pfeifer, Northbrook, IL (US);
Joe P. Wang, Long Grove, IL (US);
Cheryl B. Field, Kildeer, IL (US);
Michael Pfeifer, Northbrook, IL (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A microdevice assembly () that includes a device microstructure (), a housing (), and a fine grain getter layer (). The housing () has a base portion () and a lid (). The device microstructure () is attached to the base portion () and the lid () is hermetically sealed to the base portion (). The housing () defines a cavity () surrounding the device microstructure (). The fine grain getter layer () is on an interior side () of the lid () for maintaining a vacuum in the cavity () surrounding the device microstructure (). The lid () may be made of metal or have at least a metallic surface in the region where the fine grain getter layer () is applied. The fine grain getter layer () has a sub-micron grain size. There is also a method for making the microdevice assembly ().