The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2005
Filed:
Nov. 05, 1999
Igal Ladabaum, San Carlos, CA (US);
Igal Ladabaum, San Carlos, CA (US);
Sensant Corporation, San Leandro, CA (US);
Abstract
The present invention provides a method of packaging surface microfabricated transducers such that electrical connections, protection, and relevant environmental exposure are realized prior to their separation into discrete components. The packaging method also isolates elements of array transducers. Post processing of wafers consisting of transducers only on the top few microns of the wafer surface can be used to create a wafer scale packaging solution. By spinning or otherwise depositing polymeric and metallic thin and thick films, and by lithographically defining apertures and patterns on such films, transducers can be fully packaged prior to the final dicing steps that would separate the packaged transducers from each other. In the case of microfabricated ultrasonic transducers, such packaging layers can also enable flexible transducers and eliminate or curtail the acoustic cross-coupling that can occur between array elements.