The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6867508 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 15, 2005

Filed:

Apr. 30, 2002
Applicants:

Masayuki Tamaishi, Kashihara, JP;

Hiroshi Kanishi, Osaka, JP;

Yoshiyuki Itoh, Shiki-gun, JP;

Inventors:

Masayuki Tamaishi, Kashihara, JP;

Hiroshi Kanishi, Osaka, JP;

Yoshiyuki Itoh, Shiki-gun, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L023/58 ;
U.S. Cl.
CPC ...
Abstract

After profiles of two chips are recognized on intermediate stages and their positions are corrected, collets are used as electrodes and a voltage is applied to the chips on bonding stage on which the chips are bonded onto a submount. Then, the respective two chips are allowed to emit light, final position correction is performed on the basis of the light-emission point data and bonding is performed. The two chips can be bonded at narrow pitches by tilting the collets with respect to chip surfaces. Consequently, two laser chips can be bonded at narrow pitches on one submount in high position accuracy.


Find Patent Forward Citations

Tamaishi, Masayuki. (2005). Method and apparatus for fabricating semiconductor laser device (U.S. Patent No. 6867508). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6867508

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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