The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2005
Filed:
Apr. 12, 2001
Toyonori Kanetaka, Hyogo, JP;
Toshihiro Yoshizawa, Osaka, JP;
Akira Fujimori, Hyogo, JP;
Hideaki Nakayama, Hyogo, JP;
Hiromasa Yamamoto, Osaka, JP;
Mikio Taoka, Osaka, JP;
Kenichi Yamada, Hyogo, JP;
Toyonori Kanetaka, Hyogo, JP;
Toshihiro Yoshizawa, Osaka, JP;
Akira Fujimori, Hyogo, JP;
Hideaki Nakayama, Hyogo, JP;
Hiromasa Yamamoto, Osaka, JP;
Mikio Taoka, Osaka, JP;
Kenichi Yamada, Hyogo, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
Method of manufacturing a chip inductor including the steps of, a conductive layer forming process for forming conductive layeron an outer peripheryand end surfacesof a substrate, a coil portion forming process for forming coil portionhaving conductorand grooveby cutting spirally the conductive layeran etching process for etching the substratehaving the coil portionformed thereon; an insulation resin coating process for forming outer coatingby coating a surface of the conductive layerwith insulation resinand an electrode forming process for forming electrodesat both ends of the coil portionand for making electric contacts between electrodesand the conductive layerA chip inductor having a flattened mounting surface of the outer coating is obtained when insulation resin layeris formed by an electrodeposition method in the insulation resin coating process. The chip inductor can be securely mounted to a circuit board.