The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 15, 2005

Filed:

Jan. 29, 2003
Applicants:

Takehiko Okajima, Tokyo, JP;

Masahisa Ikeya, Tokyo, JP;

Inventors:

Takehiko Okajima, Tokyo, JP;

Masahisa Ikeya, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L021/28 ;
U.S. Cl.
CPC ...
Abstract

In a semiconductor device, particles are removed from the surface of a gold conductive layer before an intermediate insulating layer of an amino silane compound is formed. An organic insulating layer is formed on the intermediate insulating layer. As a result, adhesion strength between the conductive layer and the intermediate insulating layer can be improved.


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