The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 6867110 B1

PDF
Full Text
Expired
Date of Patent:
Mar. 15, 2005

Filed:

May. 23, 2002
Applicants:

Kazutaka Yanagita, Kanagawa, JP;

Mitsuharu Kohda, Kanagawa, JP;

Kiyofumi Sakaguchi, Kanagawa, JP;

Akira Fujimoto, Tokyo, JP;

Inventors:

Kazutaka Yanagita, Kanagawa, JP;

Mitsuharu Kohda, Kanagawa, JP;

Kiyofumi Sakaguchi, Kanagawa, JP;

Akira Fujimoto, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L021/46 ;
U.S. Cl.
CPC ...
Abstract

This invention is to guarantee that in separating a plate member such as a bonded substrate stack, a fluid is injected to an appropriate portion of the plate member. While a bonded substrate stack () is rotated, the vertical position of its peripheral portion is measured throughout its perimeter by a measuring device (). Then, while the vertical position of a nozzle () is dynamically adjusted on the basis of the measurement result, and at the same time, the bonded substrate stack () is rotated, the bonded substrate stack () is separated into two substrates at a porous layer by injecting a fluid ejected from the nozzle ().


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Yanagita, Kazutaka. (2005). Separating apparatus and processing method for plate member (U.S. Patent No. 6867110). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6867110

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