The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2005
Filed:
Mar. 28, 2002
Applicant:
Yuuichi Mikata, Yokohama, JP;
Inventor:
Yuuichi Mikata, Yokohama, JP;
Assignee:
Kabushiki Kaisha Toshiba, Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R031/26 ;
U.S. Cl.
CPC ...
Abstract
A method of manufacturing a semiconductor device is disclosed. The manufacturing method comprises heating a reactor, setting a semiconductor wafer in the reactor, supplying a reactive gas into the reactor to form a film on the semiconductor wafer or on an inner surface of the reactor, and measuring a temperature change outside the reactor and a temperature change inside the reactor to determine a thickness of the film on the semiconductor wafer or on the inner surface of the reactor on the basis of a relationship between a ratio of the temperature changes and a thickness of the film.