The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2005
Filed:
Apr. 26, 2001
Yoshihiro Kayano, Hiratsuka, JP;
Hiroyuki Imaizumi, Hiratsuka, JP;
Kazuaki Ochiai, Hiratsuka, JP;
Mitsubishi Engineering-Plastics Corp., Tokyo, JP;
Abstract
An injection-molding apparatus comprises a mold assembly having a first-molten-resin injection portion for injecting a first molten thermoplastic resin into a cavity of the mold assembly, a second-molten-resin injection portion for injecting a second molten thermoplastic resin into the cavity, and a pressurized-fluid introducing portion for introducing a pressurized fluid into the second molten thermoplastic resin injected into the cavity. The injection-molding apparatus also comprises a first injection cylinder communicating with the first-molten-resin injection portion, and a second injection cylinder communicating with the second-molten-resin injection portion.