The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2005
Filed:
Jul. 04, 2001
Setsuo Ando, Saitama-ken, JP;
Minoru Endoh, Saitama-ken, JP;
Tsutomu Nakamura, Saitama-ken, JP;
Toru Fukushi, Saitama-ken, JP;
Setsuo Ando, Saitama-ken, JP;
Minoru Endoh, Saitama-ken, JP;
Tsutomu Nakamura, Saitama-ken, JP;
Toru Fukushi, Saitama-ken, JP;
Hitachi Metals, Ltd., Tokyo, JP;
Abstract
An R-T-B magnet (R is at least one kind of rare-earth elements including Y, and T is Fe or Fe and Co) has an electrolytic copper-plating film where the ratio [I(200)/I(111)] of the X-ray diffraction peak intensity I(200) from the (200) plane to the X-ray diffraction peak intensity I(111) from the (111) plane is 0.1-0.45 in the X-ray diffraction by CuKal rays. This electrolytic copper-plating film is formed by an electrolytic copper-plating method using an electrolytic copper-plating solution which contains 20-150 g/L of copper sulphate and 30-250 g/L of chelating agent and contains no agent for reducing copper ions and has a pH adjusted to 10.5-13.5.