The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2005
Filed:
Feb. 21, 2002
David A. Dalman, Midland, MI (US);
Petar R. Dvornic, Midland, MI (US);
David A. Dalman, Midland, MI (US);
Petar R. Dvornic, Midland, MI (US);
Michigan Molecular Institute, Midland, MI (US);
Abstract
An inexpensive process for depositing an electrically conductive material on selected surfaces of a dielectric substrate may be advantageously employed in the manufacture of printed wiring boards having high quality, high density, fine-line circuitry, thereby allowing miniaturization of electronic components and/or increased interconnect capacity. The process may also be used for providing conductive pathways between opposite sides of a dielectric substrate and in decorative metallization applications. The process includes steps of depositing a radially-layered dendritic copolymer on selected surfaces of a dielectric substrate; cross-linking the radially-layered dendritic copolymer to form a dendritic polymer network; sorbing metal cations into the cross-linked dendritic polymer network; reducing the metal cations to form a nanocomposite composition exhibiting adequate surface electrical conductivity for electroplating; and electroplating a metal onto the nanocomposite composition to form an electrically conductive deposit.