The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2005
Filed:
Jun. 11, 2002
Shinichi Saiki, Aichi, JP;
Shinichi Saiki, Aichi, JP;
Kabushiki Kaisha Tokai Rika Denki Seisakusho, Aichi, JP;
Abstract
A molding apparatus includes a first die having an exterior forming surface and a second die. When the apparatus is closed, the first and second dies define a cavity. A bulge projects from the exterior forming surface of the first die toward the second die. A core receiving section, or a recess, is formed in the second die. When forming a through hole in a molded product, a first core is provided in the core receiving section. The first core contacts the bulge when the molding apparatus is closed. When a groove is formed on an exterior surface of a molded product by the bulge of the exterior forming surface, a second core is provided in the core receiving position. The second core is separated from the exterior forming surface when the apparatus is closed.