The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 15, 2005

Filed:

May. 13, 2002
Applicants:

Akio Hashimoto, Shizuoka-ken, JP;

Takaaki Ikari, Shizuoka-ken, JP;

Hiromi Takagi, Kariya, JP;

Sumi Yoshikawa, Kariya, JP;

Inventors:

Akio Hashimoto, Shizuoka-ken, JP;

Takaaki Ikari, Shizuoka-ken, JP;

Hiromi Takagi, Kariya, JP;

Sumi Yoshikawa, Kariya, JP;

Assignees:

Nippon Light Metal Co., Ltd., Tokyo, JP;

Denso Corporation, Aichi-Ken, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B22D027/09 ;
U.S. Cl.
CPC ...
Abstract

The newly proposed cast aluminum alloy product has the composition consisting of 6.5-8.0% Si, 0.25-0.45% Mg, 0.08-0.40% Fe, 0.001-0.01% Ca, P less than 0.001%, 0.02-0.1% Ti, 0.001-0.01% B, optionally one or two of 0.05-0.3% Cr and 0.05-0.2% Mn, and the balance being Al except inevitable impurities. It has the metallurgical structure that an α-Al phase in a surface layer is of average grain size different by 50 μm or less from an α-Al phase in an inner part, and that a maximum size of eutectic Si particles is 400 μm or smaller. It is manufactured by injecting a molten aluminum alloy into metal dies at an injection speed of 0.05-0.25 m/second, and then cooling the injected alloy at a cooling speed of 20° C./or higher in a temperature range between liquidus and solidus curves in a state charged with a pressure of 30 MPa or higher. Since the cast product is good of ductility, it is used as a member for coupling another member therewith by calking or the like.


Find Patent Forward Citations

Loading…