The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2005
Filed:
Jun. 25, 2002
Hiroshi Takigawa, Isehara, JP;
Tetsuro Sakano, Kawasaki, JP;
Yuji Nishikawa, Yamana, JP;
Masao Sato, Takatsuki, JP;
Shinya Naito, Yamanashi, JP;
Ryusuke Miyata, Yamanashi, JP;
Koji Hayano, Yamanashi, JP;
Hiroshi Takigawa, Isehara, JP;
Tetsuro Sakano, Kawasaki, JP;
Yuji Nishikawa, Yamana, JP;
Masao Sato, Takatsuki, JP;
Shinya Naito, Yamanashi, JP;
Ryusuke Miyata, Yamanashi, JP;
Koji Hayano, Yamanashi, JP;
Fanuc LTD, Yamanashi, JP;
Abstract
A cooling device suitable for cooling a laser diode bar constituting a surface illuminating device as a light source for exciting a laser medium of a solid-state laser oscillator of high power. The cooling device is capable of flowing coolant at sufficient flow rate by reducing the pressure loss in the flow passage of the coolant in the device, to realize a light source device of small thickness with high cooling capability and high reliability. The cooling device comprises a first plate member, one or more second plate member and a third plate member to be joined together to form a laminated body. The second plate member has grooved paths formed on both surfaces thereof and having depths greater than a half of thickness of the plate member, and also opened paths for communicating grooved paths formed on the first plate member and the third plate member. The pressure loss in the flow passage of coolant is reduced by increasing a sectional area of the flow passage by the grooved paths and the opened path of the second plate member without lowering mechanical strength of the device and without increasing a manufacturing cost of the device.