The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 08, 2005

Filed:

Apr. 23, 2002
Applicants:

Masaya Wajima, Shinminato, JP;

Tsuneo Amano, Toyama, JP;

Kenichi Kotani, Toyama-ken, JP;

Kenichi Sakai, Toyama, JP;

Inventors:

Masaya Wajima, Shinminato, JP;

Tsuneo Amano, Toyama, JP;

Kenichi Kotani, Toyama-ken, JP;

Kenichi Sakai, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K001/03 ;
U.S. Cl.
CPC ...
Abstract

An outer coating substrate for an electronic component is constructed to be calcined at a low temperature, and greatly decreases the cost thereof while greatly improving the dimensional precision of the substrate. The outer coating substrate for an electronic component includes a multi-layered substrate including a first material layer that is sintered in a liquid phase and a second material layer that is not sintered at the sintering temperature of the first material layer. The first and second material layers are laminated, and calcined at the calcining temperature of the first material layer.


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