The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2005
Filed:
Oct. 18, 2002
Yuko Hanaoka, Tokyo, JP;
Kenji Hinode, Tsukuba, JP;
Kenichi Takeda, Hachioji, JP;
Daisuke Kodama, Hachioji, JP;
Noriyuki Sakuma, Hachioji, JP;
Yuko Hanaoka, Tokyo, JP;
Kenji Hinode, Tsukuba, JP;
Kenichi Takeda, Hachioji, JP;
Daisuke Kodama, Hachioji, JP;
Noriyuki Sakuma, Hachioji, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
In extremely minute copper wiring the width or the thickness of which is equal to or shorter than approximately the double length of the mean free path of a copper atom, a value of the resistance may be larger, compared with aluminum wiring of the same extent and it is difficult to realize wiring having small resistance. To solve such a problem, aluminum wiring is used for wiring having form in which the respective resistivities ρ of both wirings have the relation of ρ<ρand copper wiring is used for wiring having form in which the respective resistivities ρ of both wirings have the relation of ρ≧ρ. As a result, a semiconductor device which has small resistance, transmits a signal at high speed and is provided with a multilayer wiring layer can be realized.