The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2005
Filed:
Jan. 25, 2002
Applicants:
Kurt Gross, Laaber, DE;
Hans Rappl, Nittendorf, DE;
Inventors:
Kurt Gross, Laaber, DE;
Hans Rappl, Nittendorf, DE;
Assignee:
Siemens Aktiengesellschaft, Munich, DE;
Primary Examiner:
Int. Cl.
CPC ...
H01L023/50 ; H01L021/58 ; H01L023/498 ; H01L023/495 ;
U.S. Cl.
CPC ...
Abstract
A carrier has a metal area that is essentially composed of copper. A chip has a rear side metallization layer. A buffer layer, essentially composed of nickel and having a thickness of between 5 μm and 10 μm, is arranged on the metal area. The chip does not have a chip housing and is arranged on the metal area, which has been provided with the buffer layer, such that only one connecting medium is arranged between the rear side metallization layer of the chip and the buffer layer.