The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2005
Filed:
Dec. 15, 2000
Applicants:
Aik Chong Tan, Johor Bahru, MY;
Chong Un Tan, Negeri Sembilan, MY;
Chee Chuan Chew, Petaling Jaya, MY;
Inventors:
Aik Chong Tan, Johor Bahru, MY;
Chong Un Tan, Negeri Sembilan, MY;
Chee Chuan Chew, Petaling Jaya, MY;
Assignee:
Semiconductor Component Industries, L.L.C., Phoenix, AZ (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L023/28 ;
U.S. Cl.
CPC ...
Abstract
A lead frame with a plurality of bump terminals is provided. Stamping an indentation into each lead in the lead frame forms the bump terminals. The bump terminals will be used as contact points in a completed semiconductor device.