The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2005
Filed:
Oct. 09, 2003
Applicants:
Mark D. Hoinkis, Fishkill, NY (US);
Matthias P. Hierlemann, Hsinchu, TW;
Mohammed Fazil Fayaz, Pleasantville, NY (US);
Andy Cowley, Wappingers Falls, NY (US);
Erdum Kaltalioglu, Hsinchu, TW;
Inventors:
Mark D. Hoinkis, Fishkill, NY (US);
Matthias P. Hierlemann, Hsinchu, TW;
Mohammed Fazil Fayaz, Pleasantville, NY (US);
Andy Cowley, Wappingers Falls, NY (US);
Erdum Kaltalioglu, Hsinchu, TW;
Assignee:
Infineon Technologies AG, Munich, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L021/4763 ;
U.S. Cl.
CPC ...
Abstract
Thermo-mechanical stress on vias is reduced, thereby reducing related failures. This can be done by maintaining a via-to-metal area ratio at least as large as a predetermined value below which the additional stress on the vias does not significantly increase.