The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2005
Filed:
Jan. 15, 2002
Kohshi Yoshimura, Hyogo, JP;
Takeshi Nishiuchi, Osaka, JP;
Fumiaki Kikui, Osaka, JP;
Shuji Tsujimoto, Osaka, JP;
Kohshi Yoshimura, Hyogo, JP;
Takeshi Nishiuchi, Osaka, JP;
Fumiaki Kikui, Osaka, JP;
Shuji Tsujimoto, Osaka, JP;
Neomax Co., Ltd., Osaka, JP;
Abstract
A resin molded product and a fine metal powder producing material are placed into a treating vessel. The fine metal powder producing material is brought into flowing contact with the surface of the resin molded product, thereby producing a fine metal powder, and forming a metal layer of the fine metal powder on the surface of the resin molded product. In this process, the metal layer of the fine metal powder can be formed firmly and at high density on the surface of the resin molded product. The metal layer exhibits a function as an electrically conductive layer. Therefore, a metal film having an excellent thickness accuracy, an excellent surface smoothness and a high peel strength can be formed in a simple manner on the metal layer by carrying out an electroplating treatment. In addition, it is possible for the metal layer itself to exhibit functions or properties such as an ornamentality.