The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 08, 2005

Filed:

Aug. 20, 1997
Applicants:

Takafumi Atarashi, Tokyo, JP;

Katsuto Nakatsuka, Sendai-shi, Miyagi, JP;

Inventors:

Takafumi Atarashi, Tokyo, JP;

Katsuto Nakatsuka, Sendai-shi, Miyagi, JP;

Assignees:

Nittetsu Mining Co., Ltd., Tokyo, JP;

Other;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B009/00 ;
U.S. Cl.
CPC ...
Abstract

A consolidated material of coated powders obtained by a method which comprises forming a molding by mutually bonding powder particles having a given property and in which the powder particles can be made to have a desired arrangement or can be arranged in positions giving such a predetermined distance that desired properties are obtainable. The present invention shows a process for producing a consolidated material of coated powders which are mutually consolidated, comprising adhering either powders each comprising a base particle having thereon a coating film having a uniform thickness of 0.01 to 20 μm or powders each comprising base particles each having thereon plural coating films having a uniform thickness of 0.01 to 5 μm per film in which at least any adjacent coating films are different in kind, at the coating film or by an adhesive.


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