The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2005
Filed:
Jan. 15, 2003
Applicants:
Annayya P. Deshpande, San Jose, CA (US);
Calvin Shyhjong Lo, Saratoga, CA (US);
Kevin Thuy Luong, San Jose, CA (US);
Artemio Juan Torres, Milpitas, CA (US);
Inventors:
Annayya P. Deshpande, San Jose, CA (US);
Calvin Shyhjong Lo, Saratoga, CA (US);
Kevin Thuy Luong, San Jose, CA (US);
Artemio Juan Torres, Milpitas, CA (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B28D001/02 ;
U.S. Cl.
CPC ...
Abstract
A method and mechanism for slicing a thin film wafer. A closure is bonded to a section of a thin film wafer. A blade is used to slice a row from the section of the wafer by cutting through the closure and thin film wafer such that opposite sides of the blade engage an equal surface area of the closure.