The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2005
Filed:
Aug. 19, 2003
Nick Youker, River Falls, MN (US);
Ronald L. Anderson, Herbster, WI (US);
John E. Hansen, Coon Rapids, MN (US);
Melburn Kjear, Woodbury, MN (US);
Nick Youker, River Falls, MN (US);
Ronald L. Anderson, Herbster, WI (US);
John E. Hansen, Coon Rapids, MN (US);
Melburn Kjear, Woodbury, MN (US);
Cardiac Pacemakers, Inc., St. Paul, MN (US);
Abstract
A miniaturized microelectronic, hybrid circuit package having either a single or a multi-layer, flexible, printed circuit substrate with printed conductors interconnecting a plurality of integrated circuit (IC) dies with a ball grid array (BGA) of contacts. The IC dies are arranged on parallel strips defined between preferential fold zones formed in the substrate. The dies are over molded with plastic that is shaped to facilitate the substrate being folded to form a polyhedron. When so folded, the over molded IC dies face inward and BGA is exposed on an outwardly facing surface to facilitate attachment of the folded package to a motherboard.