The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2005
Filed:
Dec. 18, 2002
Casmir Stanislaus Ilenda, Holland, PA (US);
Michael Louis Spera, Mohnton, PA (US);
Gordon Tullos, Reading, PA (US);
Andrew T. Daly, Sinking Spring, PA (US);
Casmir Stanislaus Ilenda, Holland, PA (US);
Michael Louis Spera, Mohnton, PA (US);
Gordon Tullos, Reading, PA (US);
Andrew T. Daly, Sinking Spring, PA (US);
Rohm and Haas Company, Philadelphia, PA (US);
Abstract
The present invention, a powder composition for making powder coatings comprising one or more than one curable polymer or resin and an agglomerate of a core-shell polymer, wherein the agglomerate of a core-shell polymer has an average particle size of from 5 to 190 microns, preferably from 10 to 127 microns. The powders in accordance with the present invention provide a cured powder coating that is flexible, smooth, and which may be applied in a thickness of only from 0.3 to 8 mils. In a preferred embodiment of making a powder in accordance with the present invention, the agglomerate is cryoground to form a reduced agglomerate prior to adding it into a powder as a post-blend or a powder-forming mixture as a preblend. The preferred core-shell polymer for use in accordance with the present invention comprises an acrylic impact modifier having a poly(methyl methacrylate) shell and a poly(butyl acrylate) core. Further, the preferred curable polymer or resin powder is an epoxy resin, wherein the powder composition is a low temperature curing one component powder composition which cures at from 107 to 149 degrees C.