The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2005
Filed:
Jul. 19, 2002
Rajan Eadara, Ann Arbor, MI (US);
Mooil Chung, Troy, MI (US);
David Wen-lung Chang, Troy, MI (US);
Sunny K. George, Sterling Heights, MI (US);
Patrick A. Ohaka, Southfield, MI (US);
Joribeth E. Joseff, Mount Pleasant, SC (US);
Yushin Ahn, Farmington Hills, MI (US);
Rajan Eadara, Ann Arbor, MI (US);
Mooil Chung, Troy, MI (US);
David Wen-Lung Chang, Troy, MI (US);
Sunny K. George, Sterling Heights, MI (US);
Patrick A. Ohaka, Southfield, MI (US);
Joribeth E. Joseff, Mount Pleasant, SC (US);
Yushin Ahn, Farmington Hills, MI (US);
Diversified Chemical Technologies, Inc., Detroit, MI (US);
Abstract
A two component, curable hot melt adhesive system includes a first hot melt adhesive formulation which has a softening temperature greater than room temperature and which includes a first component of a curable adhesive therein. The system includes a second hot melt adhesive formulation which has a softening temperature which is greater than room temperature and which includes a second component of a curable adhesive therein. The second component is reactive with the first component to provide a cured adhesive bond. In use, the two formulations are heated to a temperature above their softening temperature and are contacted so as to cause mixing. The mixture cools to provide a thermoplastic bond which subsequently cures to provide a permanent adhesive bond. While the first and the second component individually perform as hot melt adhesives, combining the first and the second gives enhanced adhesive performance in extended temperature ranges.