The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2005
Filed:
Apr. 09, 2001
Applicants:
Nobuki Tanaka, Tokyo, JP;
Hikaru Okubo, Tokyo, JP;
Ryuichi Murayama, Tokyo, JP;
Kazuto Onami, Tokyo, JP;
Tomohiro Kagimoto, Tokyo, JP;
Inventors:
Nobuki Tanaka, Tokyo, JP;
Hikaru Okubo, Tokyo, JP;
Ryuichi Murayama, Tokyo, JP;
Kazuto Onami, Tokyo, JP;
Tomohiro Kagimoto, Tokyo, JP;
Assignee:
Sumitomo Bakelite Company, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L023/48 ; C08L063/00 ;
U.S. Cl.
CPC ...
Abstract
The present invention provides a die-attaching paste superior in solder cracking resistance, used for bonding of semiconductor chips. The present invention lies in a die-attaching paste comprising as essential components: