The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2005
Filed:
Jan. 10, 2003
Bernhard Bachl, Falkensee, DE;
Günter Kirchberger, Sinzing, DE;
Franz Schellhorn, Regensburg, DE;
Martin Weigert, Hardt, DE;
Bernhard Bachl, Falkensee, DE;
Günter Kirchberger, Sinzing, DE;
Franz Schellhorn, Regensburg, DE;
Martin Weigert, Hardt, DE;
OSRAM Opto Semiconductors GmbH, Regensburg, DE;
Abstract
An LED module includes a substrate having good thermal conductivity and one or more radiation-emitting semiconductor components that fixed on the top side of the substrate. The underside of the substrate is fixed on a carrier body having a high thermal capacity, in which the component fixing between the semiconductor components and the substrate and the substrate fixing between the substrate and the carrier body are embodied with good thermal conductivity. Furthermore, the invention relates to a method for producing the LED module, in which metal areas that are suitable as an etching mask improve the impressing of the current required during the anodic bonding, and at the same time, are used as contact areas for contact-connecting the radiation-emitting semiconductor components. The LED module has the advantage that the semiconductor components can be subjected to higher energization as a result of the high thermal capacity of the carrier body.