The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2005
Filed:
Sep. 05, 2002
Dominique Dinet, Pont de Ruan, FR;
Leong Ratsimandresy, Luynes, FR;
Rémi Dufait, Tours, FR;
An Nguyen-dinh, Valleres, FR;
Aimé Flesch, Andrésy, FR;
Dominique Dinet, Pont de Ruan, FR;
Leong Ratsimandresy, Luynes, FR;
Rémi Dufait, Tours, FR;
An Nguyen-Dinh, Valleres, FR;
Aimé Flesch, Andrésy, FR;
Vermon, Tours Cedex, FR;
Abstract
A method is provided for producing a matrix array ultrasonic transducer having an integrated interconnection assembly. A piezoelectric member, formed by a plurality of individual elemental transducers arranged in M×N matrix configuration, is provided and an interconnect interface device is joined to the rear face of the piezoelectric member. A plurality of printed circuits are then attached to the interconnect device so as to enable the resultant transducer array to be electrically connected to an external cable. The interconnect device is formed by an insulator member having dimensions in accordance with those of the piezoelectric member. A drilling operation is performed on the insulator member to form a corresponding array of through holes. The insulator member is then metallized and a resin used to provide filling of the through holes. Grooves are formed in at least one face of the insulator for receiving the printed circuits.