The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 22, 2005

Filed:

Mar. 05, 2001
Applicants:

John Hryniewicz, Columbia, MD (US);

Philippe Absil, Braine l'Alleud, BE;

Brent Little, Greenbelt, MD (US);

Oliver King, Annapolis, MD (US);

Ping-tong Ho, Rockville, MD (US);

Inventors:

John Hryniewicz, Columbia, MD (US);

Philippe Absil, Braine l'Alleud, BE;

Brent Little, Greenbelt, MD (US);

Oliver King, Annapolis, MD (US);

Ping-Tong Ho, Rockville, MD (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G02B006/10 ; C03B037/022 ;
U.S. Cl.
CPC ...
Abstract

A manufacturing process is provided for fabrication of vertically coupled integrated photonic devices by projection lithographic technique. A multi-layered structure is formed which includes a pair of core waveguiding layers separated by a coupling interlayer and sandwiched between cladding layers. Prior to forming optical features in the core layers, alignment marks are etched completely through the whole multi-layered structure with the alignment marks being visible on both sides of the multi-layered structure to a conventional projection stepper. After the alignment marks are formed, a 'bottom level' optical features are made through the bottom cladding layer, bottom core layer, and portion of intervening coupling layer. The formed sample is then bonded by a polymer to a carrier and a 'top level' optical features are defined through the top cladding, top core layer, and portion of the intervening coupling layer.


Find Patent Forward Citations

Loading…