The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 2005
Filed:
Jun. 25, 2001
Chuang-chia Lin, San Pablo, CA (US);
Chuang-Chia Lin, San Pablo, CA (US);
Analog Devices Inc., Norwood, MA (US);
Abstract
A method and apparatus are described for reducing stiction in a MEMS device having a movable element and a substrate. The method generally comprises providing the substrate with an anti-stiction member and interposing the anti-stiction member between the moveable element and the substrate. The apparatus generally comprises an anti-stiction member that is interposable between the moveable element and the substrate. Another embodiment of the invention of the invention is directed to a MEMS device, comprising: a substrate, a moveable element moveably coupled to the substrate, and an anti-stiction member that is interposable between the moveable element and the substrate. A further embodiment of the invention is directed to an optical switch having one or more moveable elements moveably coupled to a substrate, and an anti-stiction member that is interposable between at least one of the moveable elements and the substrate. The anti-stiction member may be in the form of a flexible cantilevered structure that overhangs the moveable element. Actuating the moveable element causes the anti-stiction member to flex and snap into place between the moveable element and the substrate. An additional embodiment of the invention is directed to a method of fabricating a MEMS device. The method proceeds by providing a silicon-on-insulator (SOI) substrate; defining a moveable element from a device layer of the SOI substrate; and depositing a flexible material over the device layer and the moveable element. One or more portions of the flexible material overhang the moveable element, whereby the flexible material forms one or more anti-stiction members.