The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 22, 2005

Filed:

Jun. 24, 2003
Applicants:

Tetsuya Oshino, Sagamihara, JP;

Takeshi Okuyama, Yokohama, JP;

Inventors:

Tetsuya Oshino, Sagamihara, JP;

Takeshi Okuyama, Yokohama, JP;

Assignee:

Nikon Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B007/02 ;
U.S. Cl.
CPC ...
Abstract

Optical-element mountings are disclosed for holding an optical element relative to an optical column of an optical system. The optical element can have mounting protrusions extending therefrom or lack such features. An exemplary embodiment of a mounting has a respective holding device mounted to each mounting protrusion. Each holding device has a first spring-loaded support member providing rigid support of the element in a gravity direction and flexible support in tangential, radial, and tilt directions. Each holding device also can include a second spring-loaded support member providing rigid support of the element in tangential directions and flexible support in the gravity and radial directions. Another embodiment includes multiple holding devices at respective locations relative to a mounting surface of the element. Each holding device includes a respective linking unit extending from the optical column to a respective bonding member attached to a bonding location on the mounting surface. Each bonding member has a bonding pad bonded to the respective bonding location and at least first and second spring members extending from the bonding pad in respective directions to the linking unit.


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