The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 2005
Filed:
Dec. 26, 2002
Manes Eliacin, Buffalo Grove, IL (US);
Tomasz Klosowiak, Glenview, IL (US);
Robert Lempkowski, Elk Grove, IL (US);
KE Lian, Palatine, IL (US);
Manes Eliacin, Buffalo Grove, IL (US);
Tomasz Klosowiak, Glenview, IL (US);
Robert Lempkowski, Elk Grove, IL (US);
Ke Lian, Palatine, IL (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A mesoscale microelectromechanical system (MEMS) package for a micro-machine. The mesoscale micro-machine is formed on a printed circuit board () at the same time and of the same materials as the mesoscale micro-machine package. Both the micro-machine and the package have a first metal layer (), an insulating member () formed on the first metal layer, and a second metal layer () situated on the insulating layer. The package consists of a perimeter wall surrounding the micro-machine and a low-flow capping adhesive layer (). The first metal layers of both the micro-machine and the package are formed in the same process sequence, and the insulating layers of both the micro-machine and the package are formed in the same process sequence, and the second metal layers of both the micro-machine and the package are formed in the same process sequence. The low-flow capping adhesive secures an optional cover () on the package to provide an environmental seal.