The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 2005
Filed:
Jul. 30, 2003
James Chingwei LI, San Diego, CA (US);
Richard L. Pierson, Jr., Thousand Oaks, CA (US);
Berinder P. S. Brar, Newbury Park, CA (US);
John A. Higgins, Westlake Village, CA (US);
James Chingwei Li, San Diego, CA (US);
Richard L. Pierson, Jr., Thousand Oaks, CA (US);
Berinder P. S. Brar, Newbury Park, CA (US);
John A. Higgins, Westlake Village, CA (US);
Innovative Technology Licensing LLC, Thousand Oaks, CA (US);
Abstract
A BJT device configuration includes an emitter finger and via arrangement which reduces emitter finger width, and is particularly suitable for use with compound semiconductor-based devices. Each emitter finger includes a cross-shaped metal contact which provides an emitter contact; each contact comprises two perpendicular arms which intersect at a central area. A via through an interlevel dielectric layer provides access to the emitter contact; the via is square-shaped, centered over the center point of the central area, and oriented at a 45° angle to the arms. This allows the via size to be equal to or greater than the minimum process dimension, while allowing the width of the emitter finger to be as narrow as possible with the alignment tolerances still being met.