The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 22, 2005

Filed:

Jun. 11, 2003
Applicants:

Chin-long Wu, Tainan, TW;

Tung-yang Tang, Hsinchu, TW;

Shih-ming Hsu, Hsinchu, TW;

Shang-wei Chen, Hsinchu, TW;

Tein-wang Huang, Hsinchu, TW;

Inventors:

Chin-Long Wu, Tainan, TW;

Tung-Yang Tang, Hsinchu, TW;

Shih-Ming Hsu, Hsinchu, TW;

Shang-Wei Chen, Hsinchu, TW;

Tein-Wang Huang, Hsinchu, TW;

Assignee:

RiTdisplay Corporation, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L027/15 ;
U.S. Cl.
CPC ...
Abstract

A package structure of an OEL panel includes a printed circuit board, at least one OEL panel, and several bumps. Wherein, the OEL panel has several poly solder interconnections arranged in an array structure. The printed circuit board has several solder pads, which are also implemented with bumps. The at least one OEL panel is disposed on the printed circuit board to have the electric connection with the printed circuit board through the poly solder interconnections and the bumps.


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