The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 2005
Filed:
Jul. 01, 2003
Kazuhito Hosokawa, Ibaraki, JP;
Takuji Okeyui, Ibaraki, JP;
Hirofumi Fujii, Ibaraki, JP;
Yasuhik Yamamoto, Ibaraki, JP;
Kazuhito Hosokawa, Ibaraki, JP;
Takuji Okeyui, Ibaraki, JP;
Hirofumi Fujii, Ibaraki, JP;
Yasuhik Yamamoto, Ibaraki, JP;
Nitto Denko Corporation, Osaka, JP;
Abstract
A method for manufacturing a semiconductor device includes the steps of: (1) forming a plurality of electrically conductive parts on portions of an adhesive layer of an adhesive sheet, the adhesive sheet having a base layer and the adhesive layer; (2) attaching at least one semiconductor element having electrodes to the adhesive layer, wherein an electrode-free side of the semiconductor element is attached to the adhesive layer; (3) electrically connecting a wire between each of the electrically conductive parts and each of the electrodes of the semiconductor element; (4) sealing the semiconductor element in a sealing resin to form a semiconductor device on the adhesive sheet; and (5) separating the adhesive sheet from the semiconductor device. This method enables the production of thin semiconductor devices with a surface mount type.