The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 2005
Filed:
Jun. 26, 2002
Mark Hollatz, Neustadt, DE;
Andreas Roemer, Dresden, DE;
Mark Hollatz, Neustadt, DE;
Andreas Roemer, Dresden, DE;
Infineon Technologies AG, Munich, DE;
Abstract
A process for abrasive machining of surfaces of semiconductor wafers, in particular during the production of electronic memory elements, is described. In the process, a topography of the surfaces of a plurality of wafers is planarized by an at least partially mechanical route. In a further process step which takes place at a later stage, further material is removed from the planarization surfaces by the action of a liquid, chemical composition (etchback). After the planarization step and before the etchback step, a layer thickness measurement of the planarized layer is carried. The method is distinguished by the fact that the measurement results of the layer thickness measurement are used as the basis for the automatic selection or formulation of one of a plurality of chemical compositions and/or the time of action of a selected or formulated chemical composition for carrying out the etchback step.