The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 2005
Filed:
May. 31, 2002
Applicants:
Hiroshi Sakai, Tokyo, JP;
Motoji Suzuki, Tokyo, JP;
Makoto Igarashi, Niigata, JP;
Akihiro Tanaka, Niigata, JP;
Inventors:
Hiroshi Sakai, Tokyo, JP;
Motoji Suzuki, Tokyo, JP;
Makoto Igarashi, Niigata, JP;
Akihiro Tanaka, Niigata, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41N001/24 ;
U.S. Cl.
CPC ...
Abstract
A printing mask has protrusions having through holes defined therein for printing a solder paste on lands on a printed circuit board. The protrusions serve to increase the amount of solder paste filled in the through holes.
Sakai, Hiroshi. (2005). Method and apparatus for printing solder paste of different thickness on lands on printed circuit board (U.S. Patent No. 6857361). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6857361
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile