The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 2005
Filed:
Apr. 20, 2001
Mau-chung F. Chang, Los Angeles, CA (US);
Tatsuo Itoh, Los Angeles, CA (US);
Yongxi Qian, Los Angeles, CA (US);
Kang L. Wang, Santa Monica, CA (US);
Mau-Chung F. Chang, Los Angeles, CA (US);
Tatsuo Itoh, Los Angeles, CA (US);
Yongxi Qian, Los Angeles, CA (US);
Kang L. Wang, Santa Monica, CA (US);
Mastek International, Los Angeles, CA (US);
Abstract
A wireless IC interconnect system and method facilitates interconnections between first and second IC locations via a wireless transmission medium; the IC locations may be on the same chip or on separate chips. A signal to be conveyed is modulated, and the modulated signal is capacitively coupled to the wireless transmission medium—preferably a properly terminated microstrip transmission line (MTL) or a coplanar waveguide (CPW). The modulated signal is capacitively coupled from the wireless medium to a receiver which demodulates the modulated signal and provides the demodulated signal to the second IC location. In a preferred embodiment, the wireless transmission system conveys numerous signals simultaneously, with the signals modulated and demodulated with multiple access algorithms such as code-division (CDMA) and/or frequency-division (FDMA) multiple access algorithms. The interconnection system can be made reconfigurable, with the destinations of the modulated signals changed by reprogramming associated address codes.