The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 2005
Filed:
Jul. 11, 2003
Yuichiro Yamada, Kyoto, JP;
Tsuyoshi Hamatani, Ohtsu, JP;
Yuichiro Yamada, Kyoto, JP;
Tsuyoshi Hamatani, Ohtsu, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A semiconductor chip which does not increase the thickness or the board area of a semiconductor device wherein semiconductor chips are layered and does not increase the wire length between the semiconductor chips even in the case that a plurality of semiconductor chips are layered on a wiring board and a process thereof, as well as a semiconductor device, and the like, are provided. The semiconductor chip has a semiconductor substrate, first external electrodesformed on the first surfaceof the semiconductor substrate, second external electrodesformed on the second surfaceof the semiconductor substrateand through holescreated in the semiconductor substrate, wherein the through holesare provided in the inclined planesformed so that the inner angles made up of the second surfaceand the inclined planesare obtuse angles and the first external electrodesand the second external electrodesare electrically connected through conductive patternsformed so as to follow the inner walls of the through holesand the inclined planes