The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 2005
Filed:
Sep. 03, 2002
Kwang Sung Choi, Seoul, KR;
Kwang Sung Choi, Seoul, KR;
Hynix Semiconductor Inc., Kyoungki-do, KR;
Abstract
A semiconductor chip package and a method of fabricating a semiconductor chip package provide a reduced chip size package. The semiconductor chip package includes a semiconductor chip; a plurality of pads disposed on an upper surface of the semiconductor chip; a thermosetting resin formed on the upper surface of the semiconductor chip such that through-holes in the thermosetting resin expose the pads; a multi-layer wiring pattern formed on the thermosetting resin; a connecting unit electrically connecting the multi-layer wiring pattern with the pads; a solder resist on the thermosetting resin, the multi-layer wiring pattern and the connecting unit, such that at least one through-hole in the solder resist exposes a portion of the multi-layer wiring pattern; and a solder ball mounted on the through-hole of the solder resist in contact with the exposed portion of the metal pattern.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile