The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 2005
Filed:
Nov. 27, 2002
Toyohiko Kumakura, Ibaraki, JP;
Gen Murakami, Tokyo, JP;
Tomo Yasuda, Ibaraki, JP;
Masahiko Kobayashi, Ibaraki, JP;
Hidetoshi Murakami, Ibaraki, JP;
Toyohiko Kumakura, Ibaraki, JP;
Gen Murakami, Tokyo, JP;
Tomo Yasuda, Ibaraki, JP;
Masahiko Kobayashi, Ibaraki, JP;
Hidetoshi Murakami, Ibaraki, JP;
Hitachi Cable Ltd., Tokyo, JP;
Abstract
A wiring board includes a predetermined wiring section disposed on an insulation board, and an electromagnetic shielding film is placed at a position close to the wiring section. A semiconductor device includes an electromagnetic shielding film disposed on a surface, on which an integrated circuit of a semiconductor chip has been formed, through an insulative film, a lead is provided on the electromagnetic shielding film through an insulative film, the lead is electrically connected to an external terminal of the semiconductor chip, and the resulting structured material is sealed with a sealing material; and a circuit board for electronic parts composed of a circuit board prepared by forming a plurality of leads on an insulating material, and a conductor disposed on the plurality of leads through an insulating material and reducing a self inductance of the plurality of leads by flowing an eddy current through the conductor.