The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 2005
Filed:
Jan. 27, 2003
Masatsugu Shimomura, Sapporo, JP;
Masaru Tanaka, Sapporo, JP;
Hiroshi Yabu, Sapporo, JP;
Masafumi Takebayashi, Sapporo, JP;
Ryuji Monden, Chiba, JP;
Tamami Koyama, Chiba, JP;
Yoshikazu Hosoda, Chiba, JP;
Masashi Sakaguchi, Sakai, JP;
Masatsugu Shimomura, Sapporo, JP;
Masaru Tanaka, Sapporo, JP;
Hiroshi Yabu, Sapporo, JP;
Masafumi Takebayashi, Sapporo, JP;
Ryuji Monden, Chiba, JP;
Tamami Koyama, Chiba, JP;
Yoshikazu Hosoda, Chiba, JP;
Masashi Sakaguchi, Sakai, JP;
Showa Denko K.K., Tokyo, JP;
Abstract
A composite metallic materialaccording to the invention is used for, e.g., electrolytic capacitors, and includes a metallic material substrateand a high polymer thin layerhaving a fine patternformed on at least one surface of the substrateby self-organization. This high polymer thin filmis formed by, for example, drying hydrophobic organic solvent solution of high polymer compound. By subjecting this composite metallic materialto etching processing, etching pits are formed uniformly with high density based on the fine pattern.