The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 15, 2005

Filed:

Jul. 17, 2003
Applicants:

Hiroshi Sumi, Aichi, JP;

Hidetoshi Mizutani, Aichi, JP;

Manabu Sato, Nagoya, JP;

Inventors:

Hiroshi Sumi, Aichi, JP;

Hidetoshi Mizutani, Aichi, JP;

Manabu Sato, Nagoya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B009/00 ; B32B003/00 ; H01B001/02 ;
U.S. Cl.
CPC ...
Abstract

A wiring board obtained by filling a copper paste in a via hole formed on a ceramic green sheet and firing it to form an insulating layer and a via conductor, the copper paste comprising a copper powder, an organic vehicle and at least one selected from the group consisting of: a ceramic particle having an average particle size of 100 nm or less; and an FeOparticle, wherein the copper paste comprises from 6 to 20 parts by mass of the organic vehicle per 100 parts by mass of the copper powder.


Find Patent Forward Citations

Loading…